Effect of Ni, Bi concentration on the microstructure and shear behavior of low-Ag SAC–Bi–Ni/Cu solder joints

Improvement on the microstructure stability, mechanical and wetting properties of Sn–Ag–Cu lead-free solder with the addition of rare earth elements

Dingfeng Yu, Jie Zhao, Li Wang · Journal of Alloys and Compounds · 2004 · 225 citations

Materials Science, Materials Engineering, Engineering +7

Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications

S. K. Kang, Paul Lauro, Da‐Yuan Shih et al. · IBM Journal of Research and Development · 2005 · 147 citations

Friction Welding, Engineering, Pb-free Solders +20

Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates

Hiren R. Kotadia, Omid Mokhtari, M.P. Clode et al. · Journal of Alloys and Compounds · 2011 · 118 citations

Materials Science, Materials Engineering, Material Analysis +9

Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering

L.C. Tsao · Journal of Alloys and Compounds · 2010 · 100 citations

Materials Engineering, Materials Science, Sn3.5ag0.5cu Composite Solder/cu +9

The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints

Weiping Liu, Ning-Cheng Lee · JOM · 2007 · 86 citations

Materials Science, Friction Welding, Engineering +11