Effect of Ni, Bi concentration on the microstructure and shear behavior of low-Ag SAC–Bi–Ni/Cu solder joints - Concepedia

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Effect of Ni, Bi concentration on the microstructure and shear behavior of low-Ag SAC–Bi–Ni/Cu solder joints

67

Citations

11

References

2014

Year

Yang Liu, Fenglian Sun, Yang Liu, Xuemei Li

Journal of Materials Science Materials in Electronics

Materials ScienceShear BehaviorEngineeringMechanical PropertiesMechanical EngineeringMetallurgical InteractionMetallurgical ProcessBi ConcentrationMicrostructureMetal Processing

References

	Year	Citations

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