Electrical conductivity changes in bulk Sn, and eutectic Sn-Ag in bulk and in joints, from aging and thermal shock

Pb-free solders for flip-chip interconnects

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Engineering, Electrical Engineering, Materials Engineering +14

Effects of fourth alloying additive on microstructures and tensile properties of Sn–Ag–Cu alloy and joints with Cu

K.S. Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Microelectronics Reliability · 2003 · 290 citations

Natural Sciences, Materials Engineering, Materials Science +11

Influence of interfacial intermetallic compound on fracture behavior of solder joints

Hwa-Teng Lee, Ming‐Hung Chen, Huei-Mei Jao et al. · Materials Science and Engineering A · 2003 · 242 citations

Engineering, Materials Engineering, Materials Science +16

Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging

S. Choi, Thomas R. Bieler, J. P. Lucas et al. · Journal of Electronic Materials · 1999 · 215 citations

Natural Sciences, Materials Engineering, Materials Science +17

A thermodynamic study on the AgSbSn system

Chang-Seok Oh, Jae-Hyeok Shim, Byeong‐Joo Lee et al. · Journal of Alloys and Compounds · 1996 · 140 citations

Natural Sciences, Materials Science, Physics +14