T. Hogan

Electrical conductivity changes in bulk Sn, and eutectic Sn-Ag in bulk and in joints, from aging and thermal shock

Fei Guo, J.G. Lee, T. Hogan et al. · Journal of materials research/Pratt's guide to venture capital sources · 2005 · 34 citations

Natural Sciences, Materials Engineering, Materials Science +17

Statistical Analysis of a Round-Robin Measurement Survey of Two Candidate Materials for a Seebeck Coefficient Standard Reference Material

Zigang Lu, Nathan D. Lowhorn, W. Wong‐Ng et al. · Journal of Research of the National Institute of Standards and Technology · 2009 · 24 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Elastic modulus, biaxial fracture strength, electrical and thermal transport properties of thermally fatigued hot pressed LAST and LASTT thermoelectric materials

Andrew Q. Morrison, Eldon D. Case, Fei Ren et al. · Materials Chemistry and Physics · 2012 · 18 citations

Natural Sciences, Materials Engineering, Materials Science +17

Al 1−x In x As 1−y Sb y / GaSb heterojunctions and multilayers grown by molecular beam epitaxy for effective-mass superlattices

Derwin Washington, T. Hogan, P. C. Chow et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1998 · 13 citations

Engineering, Materials Engineering, Materials Science +17

Circuit model of a thermoelectric module for ac electrical measurements

Adam Downey, T. Hogan · 2005 · 13 citations

Engineering, Electrical Engineering, Circuit Theory +16