Evolution of Microstructure Across Eutectic Sn-Bi Solder Joints Under Simultaneous Thermal Cycling and Current Stressing

Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints

Chih Chen, Hua-Ching Tong, K. N. Tu · Annual Review of Materials Research · 2010 · 285 citations

Engineering, Electrical Engineering, Materials Engineering +17

Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders

Minhua Lu, Da‐Yuan Shih, Paul Lauro et al. · Applied Physics Letters · 2008 · 246 citations

Natural Sciences, Electrical Engineering, Materials Science +16

Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing

Jia-Hong Ke, H. Y. Chuang, W. L. Shih et al. · Acta Materialia · 2012 · 71 citations

Natural Sciences, Materials Engineering, Materials Science +14

Modeling thermomechanical fatigue behavior of Sn-Ag solder joints

Jin Gyun Lee, A. Telang, K. N. Subramanian et al. · Journal of Electronic Materials · 2002 · 68 citations

Natural Sciences, Materials Engineering, Materials Science +13

Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressing

Jia-Hong Ke, Tsung‐Lin Yang, Yi‐Sheng Lai et al. · Acta Materialia · 2011 · 60 citations

Engineering, Materials Engineering, Materials Science +16