H. Y. Chuang - Concepedia

Author

H. Y. Chuang

National Taiwan University ORCID

Also Known As

H. Y. Chuang, H.Y. Chuang, Hsiang-Ling Chuang, Hsiang‐Wei Chuang, Hsin-Tzu Chuang, Hsin‐Jou Chuang

Publications

419

Citations

H-Index

Concepts

All Affiliations

National Taiwan University Advanced Semiconductor Engineering (Taiwan)

About

H. Y. Chuang is an author at National Taiwan University specializing in engineering, materials science, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	10	10	401
2	Applied Physics	6	6	234
3	Natural Sciences	2	2	179
4	Chemistry	2	2	114
5	Chemical Engineering	1	1	31

H. Y. Chuang

Publications

401

Citations

H-Index

Page 1

	Year	Citations
Critical Concerns in Soldering Reactions Arising from Space Confinement in 3-D IC Packages H. Y. Chuang, Tsung‐Lin Yang, M. S. Kuo, IEEE Transactions on Device and Materials Reliability EngineeringSevere Plastic DeformationMechanical EngineeringMetal ProcessingImc Grains	2012	96
Elimination of voids in reactions between Ni and Sn: A novel effect of silver H. Y. Chuang, Jinran Yu, M. S. Kuo, Scripta Materialia Inorganic ChemistryEngineeringPhysicsNanotechnologyNatural Sciences	2011	83
Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing Jia-Hong Ke, H. Y. Chuang, W. L. Shih, Acta Materialia Materials ScienceMaterials EngineeringElectrical EngineeringElectromigration TechniqueEngineering	2012	71
Aligned short-fibre reinforced thermosets: Experiments and analysis lend little support for established theory M. R. Piggott, Matthew Ko, H. Y. Chuang Composites Science and Technology Materials ScienceFiber ReinforcementThermosetsEngineeringFiber Structure	1993	41
Effect of clay with different cation exchange capacity on the morphology and properties of poly(methyl methacrylate)/clay nanocomposites Tsung‐Yen Tsai, Chih‐Kuo Wen, H. Y. Chuang, Polymer Composites EngineeringNanostructured PolymerAbstract Pmma/clay NanocompositesModified ClaysPolymer Nanocomposites	2008	31
Electromigration in flip chip solder joints under extra high current density Yan‐Cheng Lin, Jia-Hong Ke, H. Y. Chuang, Journal of Applied Physics Chip Temperature ConstantEngineeringMechanical EngineeringChip TemperatureJoule Heating	2010	24
Critical new issues relating to interfacial reactions arising from low solder volume in 3D IC packaging H. Y. Chuang, W. M. Chen, W. L. Shih, EngineeringAdvanced Packaging (Semiconductors)Electronic PackagingMaterials ScienceMaterials Engineering	2011	17
Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate Mong‐Hsun Tsai, Yan‐Cheng Lin, H. Y. Chuang, Journal of materials research/Pratt's guide to venture capital sources Materials EngineeringMaterials ScienceEngineeringMaterial ProcessingCorrosion	2009	15
Novel Cu–RuNx composite layer with good solderability and very low consumption rate H. Y. Chuang, Cherng‐Yuan Lin, Jinn P. Chu, Journal of Alloys and Compounds Materials EngineeringMaterials ScienceGood SolderabilityEngineeringNanomaterials	2010	12
Inhibition of Gold Embrittlement in Micro-joints for Three-Dimensional Integrated Circuits W. L. Shih, Ting Yang, H. Y. Chuang, Journal of Electronic Materials Materials ScienceGold EmbrittlementEngineeringWafer Scale ProcessingMicrofabrication	2014	11

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