H. Y. Chuang

Critical Concerns in Soldering Reactions Arising from Space Confinement in 3-D IC Packages

H. Y. Chuang, Tsung‐Lin Yang, M. S. Kuo et al. · IEEE Transactions on Device and Materials Reliability · 2012 · 96 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +26

Elimination of voids in reactions between Ni and Sn: A novel effect of silver

H. Y. Chuang, Jinran Yu, M. S. Kuo et al. · Scripta Materialia · 2011 · 83 citations

Inorganic Chemistry, Engineering, Physics +6

Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing

Jia-Hong Ke, H. Y. Chuang, W. L. Shih et al. · Acta Materialia · 2012 · 71 citations

Materials Science, Materials Engineering, Electrical Engineering +8

Aligned short-fibre reinforced thermosets: Experiments and analysis lend little support for established theory

M. R. Piggott, Matthew Ko, H. Y. Chuang · Composites Science and Technology · 1993 · 41 citations

Materials Science, Fiber Reinforcement, Thermosets +10

Effect of clay with different cation exchange capacity on the morphology and properties of poly(methyl methacrylate)/clay nanocomposites

Tsung‐Yen Tsai, Chih‐Kuo Wen, H. Y. Chuang et al. · Polymer Composites · 2008 · 31 citations

Engineering, Nanostructured Polymer, Abstract Pmma/clay Nanocomposites +23