Concepedia
Scripta Materialia · 2011 · 84 citations · 16 references
Natural SciencesChemistryMaterials ScienceInorganic ChemistryMaterials ChemistryPhysical ChemistryChemical ReactionsMetal SulfidesMetalsReaction MechanismsVoid Reactivity Effects
16
Interfacial reaction issues for lead-free electronic solders
Cheng–En Ho, Shenghao Yang, C. R. Kao · Journal of Materials Science Materials in Electronics · 2006 · 272 citations
Natural Sciences, Materials Engineering, Materials Science +12
Thermal and electrical properties of copper-tin and nickel-tin intermetallics
H. P. R. Frederikse, R.J. Fields, A. Feldman · Journal of Applied Physics · 1992 · 155 citations
Natural Sciences, Materials Engineering, Materials Science +17
Solid state diffusion in Cu–Sn and Ni–Sn diffusion couples with flip-chip scale dimensions
Riet Labie, Wouter Ruythooren, Jan Van Humbeeck · Intermetallics · 2006 · 134 citations
Engineering, Materials Engineering, Materials Science +17
Growth behavior of Ni3Sn4 layer during reactive diffusion between Ni and Sn at solid-state temperatures
Mai Mita, Masanori Kajihara, N. Kurokawa et al. · Materials Science and Engineering A · 2005 · 108 citations
Natural Sciences, Materials Engineering, Materials Science +11
Morphology and kinetic study of the interfacial reaction between the Sn-3.5Ag solder and electroless Ni-P metallization
Zhong Chen, Min He, Guo-Jun Qi · Journal of Electronic Materials · 2004 · 82 citations