Concepedia

Author

W. L. Shih

National Taiwan University

Also Known As

W. L. Shih, W.L. Shih, W.‐L. Shih

11

Publications

221

Citations

8

H-Index

17

Concepts

All Affiliations

National Taiwan UniversityIntel (Taiwan)
WL

About

W. L. Shih is an author at National Taiwan University specializing in materials science, engineering, and microfabrication.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

6

6

190

2

Applied Physics

4

4

147

3

Materials Engineering

2

2

88

4

Chemistry

1

1

13

5

Electrical Engineering

1

1

71

W. L. Shih

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8

Publications

210

Citations

8

H-Index

YearCitations

Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing

Jia-Hong Ke, H. Y. Chuang, W. L. Shih,

Acta Materialia

2012

71

Effects of silver addition on Cu–Sn microjoints for chip-stacking applications

Tsung‐Lin Yang, Jinran Yu, W. L. Shih,

Journal of Alloys and Compounds

2014

48

Volume Shrinkage Induced by Interfacial Reaction in Micro-Ni/Sn/Ni Joints

C. C. Li, C. Key Chung, W. L. Shih,

Metallurgical and Materials Transactions A

2014

30

Critical new issues relating to interfacial reactions arising from low solder volume in 3D IC packaging

H. Y. Chuang, W. M. Chen, W. L. Shih,

2011

17

Reaction Within Ni/Sn/Cu Microjoints for Chip-Stacking Applications

Yi-Wun Wang, W. L. Shih, H. T. Hung,

Journal of Electronic Materials

2018

13

Inhibition of Gold Embrittlement in Micro-joints for Three-Dimensional Integrated Circuits

W. L. Shih, Ting Yang, H. Y. Chuang,

Journal of Electronic Materials

2014

11

Amorphous Pd layer as a highly effective oxidation barrier for surface finish of electronic terminals

C.C. Li, W. L. Shih, C. Key Chung,

Corrosion Science

2014

10

Abnormal Cu3Sn growth through grain boundary penetration in space-confined Ni-Sn-Cu diffusion couples

Yi-Wun Wang, Z. X. Zhu, W. L. Shih,

Journal of Alloys and Compounds

2019

10

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