W. L. Shih

Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing

Jia-Hong Ke, H. Y. Chuang, W. L. Shih et al. · Acta Materialia · 2012 · 71 citations

Materials Science, Materials Engineering, Electrical Engineering +8

Effects of silver addition on Cu–Sn microjoints for chip-stacking applications

Tsung‐Lin Yang, Jinran Yu, W. L. Shih et al. · Journal of Alloys and Compounds · 2014 · 48 citations

Materials Science, Engineering, Advanced Packaging (Semiconductors) +9

Volume Shrinkage Induced by Interfacial Reaction in Micro-Ni/Sn/Ni Joints

C. C. Li, C. Key Chung, W. L. Shih et al. · Metallurgical and Materials Transactions A · 2014 · 30 citations

Materials Science, Friction Welding, Engineering +6

Critical new issues relating to interfacial reactions arising from low solder volume in 3D IC packaging

H. Y. Chuang, W. M. Chen, W. L. Shih et al. · 2011 · 17 citations

Engineering, Advanced Packaging (Semiconductors), Electronic Packaging +17

Reaction Within Ni/Sn/Cu Microjoints for Chip-Stacking Applications

Yi-Wun Wang, W. L. Shih, H. T. Hung et al. · Journal of Electronic Materials · 2018 · 13 citations

Materials Science, Wafer Scale Processing, Engineering +6