Publication | Closed Access
Effects of silver addition on Cu–Sn microjoints for chip-stacking applications
48
Citations
20
References
2014
Year
Materials ScienceEngineeringAdvanced Packaging (Semiconductors)MicrofabricationNanotechnologyChip On BoardApplied PhysicsChip AttachmentElectronic PackagingMicroelectronicsInterconnect (Integrated Circuits)Silver Addition
| Year | Citations | |
|---|---|---|
Page 1
Page 1