C. Key Chung

Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics

Y.J. Chen, C. Key Chung, Chenlin Yang et al. · Microelectronics Reliability · 2012 · 65 citations

Natural Sciences, Materials Engineering, Materials Science +11

Direct evidence for a Cu-enriched region at the boundary between Cu6Sn5 and Cu3Sn during Cu/Sn reaction

C. Key Chung, Jenq‐Gong Duh, C. R. Kao · Scripta Materialia · 2010 · 53 citations

Natural Sciences, Materials Engineering, Materials Science +4

Thermodynamic and structural evolution of Dy2Ti2O7 pyrochlore after swift heavy ion irradiation

C. Key Chung, Jacob Shamblin, Eric C. O’Quinn et al. · Acta Materialia · 2017 · 42 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +16

Origin and evolution of voids in electroless Ni during soldering reaction

C. Key Chung, Y.J. Chen, W.M. Chen et al. · Acta Materialia · 2012 · 37 citations

Natural Sciences, Materials Engineering, Materials Science +11

The orientation relationship between Ni and Cu6Sn5 formed during the soldering reaction

W.M. Chen, Tsung‐Lin Yang, C. Key Chung et al. · Scripta Materialia · 2011 · 34 citations

Natural Sciences, Materials Engineering, Materials Science +10