Concepedia
Scripta Materialia · 2011 · 34 citations · 15 references
Materials EngineeringMaterials ScienceEngineeringCorrosionOrientation RelationshipSoldering ReactionMetallurgical InteractionAlloy DesignMetallurgical ProcessChemistryMetallurgical SystemMicrostructureMetal Processing
15
Interfacial reactions between lead-free solders and common base materials
Tomi Laurila, Vesa Vuorinen, J.K. Kivilahti · Materials Science and Engineering R Reports · 2005 · 1.1K citations
Materials Science, Interfacial Reactions, Engineering +4
Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni
Cheng–En Ho, Rung‐Ywan Tsai, Y. L. Lin et al. · Journal of Electronic Materials · 2002 · 324 citations
Materials Science, Materials Engineering, Chemical Engineering +8
Interfacial reaction issues for lead-free electronic solders
Cheng–En Ho, Shenghao Yang, C. R. Kao · Journal of Materials Science Materials in Electronics · 2006 · 272 citations
Materials Science, Electrical Engineering, Engineering +6
Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders
W. T. Chen, Cheng–En Ho, C. R. Kao · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 208 citations
Materials Engineering, Materials Science, Interfacial Reactions +8
Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals
Hua Zou, H.J. Yang, Z.F. Zhang · Acta Materialia · 2008 · 200 citations
Materials Science, Materials Engineering, Engineering +9