Y.J. Chen

A new direct method for updating structural models based on measured modal data

Y.B. Yang, Y.J. Chen · Engineering Structures · 2008 · 86 citations

Modal Analysis, Engineering, Structural Analysis +12

Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics

Y.J. Chen, C. Key Chung, Chenlin Yang et al. · Microelectronics Reliability · 2012 · 65 citations

Materials Science, Engineering, Severe Plastic Deformation +9

Origin and evolution of voids in electroless Ni during soldering reaction

C. Key Chung, Y.J. Chen, W.M. Chen et al. · Acta Materialia · 2012 · 37 citations

Materials Science, Materials Engineering, Electromigration Technique +9

The critical oxide thickness for Pb-free reflow soldering on Cu substrate

C. Key Chung, Y.J. Chen, C.C. Li et al. · Thin Solid Films · 2012 · 30 citations

Materials Science, Materials Engineering, Cu Substrate +11

Gold and palladium embrittlement issues in three-dimensional integrated circuit interconnections

Y.J. Chen, Tsung‐Lin Yang, Jinran Yu et al. · Materials Letters · 2013 · 16 citations

3D Ic Architecture, Electrical Engineering, Wafer Scale Processing +12