H. T. Hung

Interfacial reactions between PbTe-based thermoelectric materials and Cu and Ag bonding materials

C. C. Li, Fivos Drymiotis, L. L. Liao et al. · Journal of Materials Chemistry C · 2015 · 54 citations · Full text

Interfacial Reactions, Engineering, Thermoelectrics +17

Highly uniform microfluidic electroless interconnections for chip stacking applications

H. T. Hung, Zenghui Ma, Po‐Shao Shih et al. · Electrochimica Acta · 2021 · 31 citations

Electrical Engineering, Engineering, Microfabrication +7

Phase formation and microstructure evolution in Cu/In/Cu joints

Y. S. Chiu, Haiyang Yu, H. T. Hung et al. · Microelectronics Reliability · 2019 · 27 citations

Materials Science, Engineering, Metallurgical Interaction +4

Chip-to-Chip Direct Interconnections by Using Controlled Flow Electroless Ni Plating

H. T. Hung, Shi‐Yi Yang, Y. B. Chen et al. · Journal of Electronic Materials · 2017 · 26 citations

Electrical Engineering, Wafer Scale Processing, Engineering +10

Materials Merging Mechanism of Microfluidic Electroless Interconnection Process

Shi‐Yi Yang, H. T. Hung, Po‐Yi Wu et al. · Journal of The Electrochemical Society · 2018 · 26 citations

Engineering, Mechanical Engineering, Bond Copper Pillars +17