Concepedia

L. L. Liao

LL

4

Publications

197

Citations

4

H-Index

2015

Active since

Affiliations

National Taiwan University(Current)

Industrial Technology Research Institute

California Institute of Technology

L. L. Liao is an author at National Taiwan University specializing in engineering, electronic packaging, and materials engineering.

Top concepts

EngineeringElectronic PackagingMaterial ScienceMaterials EngineeringElectrical EngineeringApplied PhysicsThermoelectricsMicroelectronicsIntegrated CircuitsHeat Transfer

Publications per year

2015–2020

4

Publications

4

Au–Sn bonding material for the assembly of power integrated circuit module

Z. X. Zhu, C.C. Li, L. L. Liao et al. · Journal of Alloys and Compounds · 2016 · 98 citations

Materials Science, Materials Engineering, Electrical Engineering +9

Interfacial reactions between PbTe-based thermoelectric materials and Cu and Ag bonding materials

C. C. Li, Fivos Drymiotis, L. L. Liao et al. · Journal of Materials Chemistry C · 2015 · 54 citations · Full text

Interfacial Reactions, Engineering, Thermoelectrics +17

Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressing

C. C. Li, Fivos Drymiotis, L. L. Liao et al. · Energy Conversion and Management · 2015 · 31 citations

Materials Science, Materials Engineering, Electrical Engineering +11

Hybrid Fan-out Package for Vertical Heterogeneous Integration

Po-Yao Chuang, Mu-Shan Lin, Shawn Hung et al. · 2020 · 14 citations

Engineering, Device Integration, Mechanical Engineering +20

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