Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressing - Concepedia

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Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressing

31

Citations

21

References

2015

Year

C. C. Li, Fivos Drymiotis, L. L. Liao, M. J. Dai, C. K. Liu, Chi‐Liang Chen, Yang-Yuan Chen, C. R. Kao, G. Jeffrey Snyder

Energy Conversion and Management

Materials ScienceMaterials EngineeringElectrical EngineeringRapid Hot-pressingEngineeringThermal TransportApplied PhysicsThermoelectricsThermoelectric MaterialEffective Bonding LayerElectronic PackagingThermal ConductionThermal ConductivityThermal Property

References

	Year	Citations

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