Concepedia

Publication | Closed Access

Highly uniform microfluidic electroless interconnections for chip stacking applications

DOI

31

Citations

27

References

2021

Year

H. T. Hung, Zenghui Ma, Po‐Shao Shih, J.H. Huang, Li-Cheng Kao, C.Y. Yang, Vengudusamy Renganathan, Chin-Li Kao
Electrochimica Acta

References

YearCitations

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