Flip chip attachment on flexible LCP substrate using an ACF

Foreword contributions from the 50th electronic components and technology conference

R. Boudreau · IEEE Transactions on Advanced Packaging · 2001 · 519 citations

Engineering, Computer Engineering, Electrical Engineering +16

Conductive Adhesives for Electronics Packaging

Microelectronics International · 2000 · 159 citations

Engineering, Materials Engineering, Materials Science +12

Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates

Zonghe Lai, Johan Liu · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1996 · 156 citations

Engineering, Materials Engineering, Materials Science +17

A new laminate material for high performance PCBs: liquid crystal polymer copper clad films

E. Culbertson · 2002 · 57 citations

Natural Sciences, Materials Engineering, Materials Science +16

Study of adhesive flip chip bonding process and failure mechanisms of ACA joints

Anne Seppälä, E. Ristolainen · Microelectronics Reliability · 2003 · 49 citations

Engineering, Materials Engineering, Materials Science +11