Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2001 · 26 citations · 2 references
EngineeringMaterials EngineeringMaterials ScienceMicrofabricationSemiconductor DevicesSurface ScienceChemical Vapor DepositionEtching ProcessesHigh-temperature PlasmasPlasma Surface TreatmentPlasma-surface InteractionsPlasma-wall InteractionsChemical EtchingEtch ChemistryEtch MechanismsEtch RatePlasma EtchingSilicon EtchingSurface Etching
Views Icon Views Article contents Figures & tables Video Audio Supplementary Data Peer Review Share Icon Share Twitter Facebook Reddit LinkedIn Tools Icon Tools Reprints and Permissions Cite Icon Cite Search Site Citation Th. Arnold, G. Boehm, A. Schindler; Ultrahigh-rate plasma jet chemical etching of silicon. Journal of Vacuum Science & Technology A 1 September 2001; 19 (5): 2586–2589. https://doi.org/10.1116/1.1395621 Download citation file: Ris (Zotero) Reference Manager EasyBib Bookends Mendeley Papers EndNote RefWorks BibTex toolbar search Search Dropdown Menu toolbar search search input Search input auto suggest filter your search All ContentAVS: Science & Technology of Materials Interfaces and ProcessingJournal of Vacuum Science & Technology A Search Advanced Search |Citation Search
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Superhigh-rate plasma jet etching of silicon
Ladislav Bárdoš, S. Berg, Hans‐Olof Blom · Applied Physics Letters · 1989 · 31 citations