Applied Physics Letters · 1978 · 33 citations · 6 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsDevice CharacterizationDopingHigh-frequency Semiconductor DevicesIon ImplantationMetal-oxide-semiconductor Field-effect TransistorsSemiconductor Device MaterialsChannel DopingCurrentsDopant ImplantationImplantation Through Thin FilmsIn-situ DopingIon Implantation EffectsMetallizationSilicon Doping
Device-quality n-type layers have been produced by ion implantation in Fe-doped semi-insulating InP. 29Si has been used as the dopant and anneals were carried out with the aid of a multiple-layered encapsulant consisting of plasma-deposited Si3N4 and pyrolytic P-doped SiO2. These layers have been used to make n-channel MESFET’s for which gains of 13.7 and 9.8 dB were measured at 8 and 10 GHz, respectively. The gate metallization for these devices was Au. Low-leakage currents and adequate gate breakdown characteristics were observed.
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R.N. Lee, Marriner K. Norr, R.L. Henry et al. · Materials Research Bulletin · 1977 · 24 citations
Natural Sciences, Materials Engineering, Materials Science +11