Applied Physics Letters · 1987 · 20 citations · 4 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsDopingEpitaxial GrowthSemiconductor Crystal GrowthSemiconductor Device MaterialsSemiconductor HeterostructuresSemiconductor PhysicsDoping Effects On Device PerformanceEpitaxial MaterialsInterstitial DopingSecondary Ion Mass Spectrometry
InGaAs epitaxial layers have been doped with beryllium with concentrations ranging from 1016 to 5×1019 cm−3 as measured by secondary ion mass spectroscopy (SIMS). From electrical measurements we have observed that p-type layers presented a high degree of compensation, and for a doping level below 5×10−7 cm−3, they are often found to be n type. SIMS analysis shows that oxygen is responsible for such behavior. Beryllium doping leads to incorporation of a large amount of oxygen in the epitaxial layers. Investigations on the origin of oxygen incorporation show that it is extremely sensitive to the residual vacuum during the growth and can be reduced by decreasing arsenic pressure.
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Residual defect center in GaInAs/InP films grown by molecular beam epitaxy
S. Loualiche, A. Gauneau, Alain Le Corre et al. · Applied Physics Letters · 1987 · 35 citations