Integrated ferroelectrics · 2007 · 12 citations · 15 references
EngineeringMaterials EngineeringMaterials ScienceMicroelectromechanical SystemsMicrofabricationThin FilmsDielectricsMems FabricationMems MaterialsMicrofabrication MaterialsThin Film Thermal PropertiesThin-film MaterialsDeflection MeasurementHeating Profile ControlPiezoelectric PropertiesPiezoelectric Thin FilmsThermomechanical StressThin-film Piezoelectric CeramicsThin-film Piezoelectrics
ABSTRACT Pb(ZrxTi1 – x)O3 (PZT) sol (≥ 0.6M) was spun onto platinised silicon substrate. The single layer thickness of a dense, crack-free film up to 500 nm could be obtained. It was found that the key factor in obtaining thick crack-free films was to choose an appropriate heating profile, using a method based on the wafer deflection measurement. By using the temperature profile to thermally treat each single layer, it was possible to obtain thick crack-free films by repeatedly spin-coating. The dielectric and piezoelectric properties of the films with different thicknesses and orientations were measured and compared.
15
J. F. Scott, Carlos A. Paz de Araújo · Science · 1989 · 3.8K citations
Natural Sciences, Electrical Engineering, Materials Science +17
Piezoelectric micromotors for microrobots
Anita M. Flynn, Lee S. Tavrow, Stephen F. Bart et al. · Journal of Microelectromechanical Systems · 1992 · 229 citations
Engineering, Mechanical Engineering, Robotics Engineering +15