Effect of Ag addition to Zn–12Al alloy on kinetics of growth of intermediate phases on Cu substrate

Development of high-temperature solders: Review

Guang Zeng, Stuart D. McDonald, Kazuhiro Nogita · Microelectronics Reliability · 2012 · 299 citations

Natural Sciences, Materials Engineering, Materials Science +10

Alloy design of Zn–Al–Cu solder for ultra high temperatures

Namhyun Kang, Hye Sung Na, Seong Jun Kim et al. · Journal of Alloys and Compounds · 2007 · 125 citations

Natural Sciences, Materials Engineering, Materials Science +14

Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates

Hiren R. Kotadia, Omid Mokhtari, M.P. Clode et al. · Journal of Alloys and Compounds · 2011 · 120 citations

Natural Sciences, Materials Engineering, Materials Science +12

Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn–Zn lead-free solder

Ramani Mayappan, Zainal Arifin Ahmad · Intermetallics · 2009 · 101 citations

Natural Sciences, Materials Engineering, Materials Science +17

Thermodynamic prediction of interface phases at Cu/solder joints

Hyuck Mo Lee, Seung Wook Yoon, Byeong‐Joo Lee · Journal of Electronic Materials · 1998 · 96 citations

Natural Sciences, Materials Engineering, Materials Science +16