Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn–Zn lead-free solder

Lead-free Solders in Microelectronics

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Interfacial reactions between lead-free solders and common base materials

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Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

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Engineering, Mechanical Engineering, Chemistry +17

Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation

Byeong‐Joo Lee, Nong‐Moon Hwang, Hyuck Mo Lee · Acta Materialia · 1997 · 266 citations

Materials Science, Materials Engineering, Engineering +11

Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging

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