Ramani Mayappan

Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn–Zn lead-free solder

Ramani Mayappan, Zainal Arifin Ahmad · Intermetallics · 2009 · 99 citations

Materials Science, Materials Engineering, Engineering +8

The effect of crosshead speed on the joint strength between Sn-Zn-Bi lead-free solders and Cu substrate

Ramani Mayappan, Ahmad Badri Ismail, Zainal Arifin Ahmad et al. · Journal of Alloys and Compounds · 2006 · 37 citations

Materials Engineering, Materials Science, Engineering +9

The effect of adding Zn into the Sn–Ag–Cu solder on the intermetallic growth rate

Ramani Mayappan, Iziana Yahya, Noor Asikin Ab Ghani et al. · Journal of Materials Science Materials in Electronics · 2014 · 29 citations

Materials Science, Materials Engineering, Engineering +5

Effect of sample perimeter and temperature on Sn–Zn based lead-free solders

Ramani Mayappan, Ahmad Badri Ismail, Zainal Arifin Ahmad et al. · Materials Letters · 2006 · 25 citations

Materials Engineering, Materials Science, Engineering +3

Phase development in La2O3 doped Al2O3:TiO2 ceramic membranes

U. Stefan Björkert, Ramani Mayappan, D. Holland et al. · Journal of the European Ceramic Society · 1999 · 16 citations

Materials Engineering, Materials Science, Phase Development +4