Wetting reaction of Sn-Ag based solder systems on Cu substrates plated with Au and/or Pd layer

III. An essay on the cohesion of fluids

Thomas Young · Philosophical Transactions of the Royal Society of London · 1805 · 6.4K citations

Engineering, Physics, Fluid Dynamics +11

SLT Device Metallurgy and its Monolithic Extension

P. A. Totta, R.P. Sopher · IBM Journal of Research and Development · 1969 · 241 citations

Engineering, Materials Engineering, Materials Science +15

Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging

S. Choi, Thomas R. Bieler, J. P. Lucas et al. · Journal of Electronic Materials · 1999 · 215 citations

Natural Sciences, Materials Engineering, Materials Science +17

Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders

S. K. Kang, S. Purushothaman · Journal of Electronic Materials · 1996 · 162 citations

Natural Sciences, Materials Engineering, Materials Science +12

Soldering in electronics

G.W.A.D. · Microelectronics Reliability · 1984 · 157 citations