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On-product overlay enhancement using advanced litho-cluster control based on integrated metrology, ultra-small DBO targets and novel corrections
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2013
Year
Advanced PackagingSystem On ChipIntegrated MetrologyEngineeringAdvanced Packaging (Semiconductors)Chip On BoardComputer EngineeringSystems EngineeringSystem-level DesignIn-chip Overlay ControlIntegrated CircuitsElectronic PackagingInstrumentationMicroelectronicsOn-product Overlay EnhancementScanner Interface TodayAdvanced Litho-cluster ControlAdvanced Nodes
Aggressive on-product overlay requirements in advanced nodes are setting a superior challenge for the semiconductor industry. This forces the industry to look beyond the traditional way-of-working and invest in several new technologies. Integrated metrology<sup>2</sup>, in-chip overlay control, advanced sampling and process correction-mechanism (using the highest order of correction possible with scanner interface today), are a few of such technologies considered in this publication.