Etching characteristics and modeling for oval-shaped contact

Profile control of high aspect ratio trenches of silicon. II. Study of the mechanisms responsible for local bowing formation and elimination of this effect

Mohamed Boufnichel, S. Aachboun, Philippe Lefaucheux et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2003 · 58 citations

Engineering, Materials Engineering, Materials Science +15

Structural Effects on a Submicron Trench Process

Daeje Chin, Sang Dhong, Glenn J. Long · Journal of The Electrochemical Society · 1985 · 51 citations

Engineering, Electrical Engineering, Materials Science +17

Etched Shape Control of Single‐Crystal Silicon in Reactive Ion Etching Using Chlorine

Masaaki Sato, Yoshinobu Arita · Journal of The Electrochemical Society · 1987 · 49 citations

Engineering, Materials Engineering, Materials Science +14

Redeposition during Deep Trench Etching

Yeong‐Jyh Lii, Jacob Jorné · Journal of The Electrochemical Society · 1990 · 27 citations

Engineering, Materials Engineering, Materials Science +17