IEEE Electron Device Letters · 1987 · 36 citations · 4 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsOptoelectronicsSemiconductor DevicesComplementary Metal-oxide-semiconductor TechnologyImplant TechnologyIntegrated Circuit DesignIon ImplantationP-n JunctionsCapacitanceCapacitance ReductionOutput ImpedanceP-n Junction CharacteristicsSeries ResistanceShallow Junction FormationThermal ActivationThreshold Voltage
We describe a high-performance fully ion-implanted planar InP junction FET fabricated by a shallow (4000-Å) n-channel implant, an n <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">+</sup> source-drain implant to reduce FET series resistance, and a p-gate implant to form a shallow (2000-Å) abrupt p-n junction, followed by a rapid thermal activation. From FET's with gates 2 µm long, a transconductance of 50 mS/mm and an output impedance of 400 Ω.mm are measured at zero gate bias with a gate capacitance of 1.2 pF/mm. The FET has a threshold voltage of -2.4 V, and a saturated drain current of 60 mA/mm at V <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">gs</inf> = 0 V with negligible drift.
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Planar fully ion implanted InP power junction FET's
J. B. Boos, S.C. Binari, G. Kelner et al. · IEEE Electron Device Letters · 1984 · 25 citations
Fully ion implanted InP junction FET's
J.B. Boos, H.B. Dietrich, Tianqi Weng et al. · IEEE Electron Device Letters · 1982 · 15 citations
InP JFETs by shallow Zn diffusion
J.B. Boos, Tianqi Weng, S.C. Binari et al. · 1983 · 13 citations