International Communications in Heat and Mass Transfer · 2005 · 21 citations · 1 references
EngineeringComputer EngineeringElectrical EngineeringMicroelectronicsSemiconductor DevicesSystem-on-chip DesignChip PackagingDevice CharacterizationDevice SimulationIntegrated Circuit DesignInterconnect DesignVery-large-scale Integration LayoutElectromigration AnalysisHigh-density InterconnectsIc Physical Design VerificationInterconnect CharacterizationInterconnect ModelingPackage ParasiticsWire Sizing
1