Journal of Applied Physics · 1999 · 48 citations · 21 references
EngineeringMaterials EngineeringMaterials ScienceCrystal StructureSemiconductor MaterialsThin FilmsAmorphous SemiconductorsDislocations In SemiconductorsEpitaxial GrowthSemiconductor SurfacesSemiconductor Thin FilmsThin-film MaterialsAmorphous StructureEpitaxial Film GrowthEpitaxial Thin-film GrowthGrain BoundariesLow-temperature GrowthMolecular Beam EpitaxyReflection High-energy Electron DiffractionTransmission Electron Diffraction
AlN thin films were grown on HF-etched Si(111) substrates at 400–600 °C by plasma source molecular beam epitaxy. Reflection high energy electron diffraction and transmission electron microscopy studies show that AlN films grown at 400 °C form an initial amorphous region at the interface, followed by c-axis oriented columnar grains with slightly different tilts and twists. AlN films grown at 600 °C showed a significantly reduced amorphous region near the interface promoting an epitaxial growth of AlN with AlN[0001]∥Si[111] and AlN[011̄0]∥Si[112̄] orientations. However, all the films show numerous defects such as stacking faults, dislocations, and grain boundaries.
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