Grain nucleation and texture analysis of electroless copper deposition on a palladium seed layer

Texture and microstructure of thin copper films

D. P. Tracy, D. B. Knorr · Journal of Electronic Materials · 1993 · 122 citations

Natural Sciences, Materials Engineering, Materials Science +12

Electroless Copper Deposition Process Using Glyoxylic Acid as a Reducing Agent

Hideo HONMA, Takeshi Kobayashi · Journal of The Electrochemical Society · 1994 · 91 citations

Natural Sciences, Materials Engineering, Materials Science +14

Materials Issues in Copper Interconnections

J. M. E. Harper, E. G. Colgan, C-K. Hu et al. · MRS Bulletin · 1994 · 78 citations

Natural Sciences, Materials Engineering, Materials Science +9

Electroless Cu for VLSI

James S.H. Cho, Ho-Kyu Kang, S.S. Wong et al. · MRS Bulletin · 1993 · 71 citations

Engineering, Computer Engineering, Electrical Engineering +11

Microstructure and Mechanical Properties of Electroless Copper Deposits

S. Nakahara, Y. Okinaka · Annual Review of Materials Science · 1991 · 43 citations

Natural Sciences, Materials Engineering, Materials Science +13