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Deposition factors and band gap of zinc-blende AlN
120
Citations
16
References
2001
Year
Aluminium NitrideOptical MaterialsEngineeringChemical DepositionBand GapSemiconductorsMolecular Beam EpitaxyEpitaxial GrowthMaterials EngineeringMaterials ScienceSuccessful DepositionMaterial AnalysisSurface ScienceApplied PhysicsZinc-blende Aln FilmsDeposition FactorsThin FilmsChemical Vapor DepositionSolar Cell Materials
Successful deposition of zinc-blende AlN films with thickness up to 1000 Å was performed with plasma source molecular beam epitaxy. The films were epitaxial to the Si(001) substrate. The formation of a thin 3C-SiC layer on the Si(001) surface is one of the important factors for the formation of zinc-blende AlN. Evidence for the presence of 3C-SiC is provided by an Auger electron spectroscopy depth profile and a high-resolution transmission electron microscopy plot profile. Spectroscopic ellipsometry was used to determine the optical constants of zinc-blende AlN in the range from 1.85 to 6.5 eV. The extinction coefficient data indicates that zinc-blende AlN is an indirect semiconductor with a band gap of ∼5.34 eV.
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1992 | 1.1K | |
1991 | 392 | |
1989 | 362 | |
1993 | 250 | |
1992 | 229 | |
1991 | 208 | |
1992 | 192 | |
1997 | 182 | |
1991 | 120 | |
1993 | 105 |
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