Journal of Micromechanics and Microengineering · 2009 · 11 citations · 27 references
EngineeringMechanical EngineeringRobotics EngineeringActuatorsMicroelectromechanical SystemsMicrofabricationElectrostatic ActuationElectrostatic ActuatorsMems ActuatorsMems DesignMems FabricationMems ModelingClamp DesignComb-drive ActuatorsConstraint DesignDeep Reactive Ion EtchingFabricationParallel-plate ActuatorsSiliconSuspension Stiffness
In this paper the design, modeling and fabrication of a precision MEMS-based clamp with arelatively large clamping force are presented. The purpose of the clamp is to mechanically fixa six-degree-of-freedom (DOF) MEMS-based sample manipulator (Brouwer et al J. Int. Soc. Precis. Eng. Nanotechnol. submitted) once the sample has been positioned in all DOFs. The clamping force is generated by a rotational electrostatic comb-drive actuator and can be latched passively by a parallel plate type electrostatically driven locking device. The clamp design is based on the principles of exact constraint design, resulting in a high actuation compliance (flexibility) combined with a high suspension stiffness. Therefore, a relatively large blocking force of 1.4 mN in relation to the used area of 1.8 mm^2 is obtained. The fabrication is based on silicon bulk micromachining technology and combines a high-aspect-ratio deep reactive ion etching (DRIE), conformal deposition of low-pressure chemical vapor deposition (LPCVD) silicon nitride and an anisotropic potassium hydroxide (KOH) backside etching technology. Special attention is given to void reduction of SixNy trench isolation and reduction of heating phenomena during front-side release etching. Guidelines are given for the applied process. Measurements showed that the clamp was able to fix, hold and release a test actuator. The dynamic behavior was in good agreement with the modal analysis.
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Donnie Moorefield · Precision Engineering · 1993 · 560 citations
Design for Precision: Current Status and Trends
P.H.J. Schellekens, Nick Rosielle, H. Vermeulen et al. · CIRP Annals · 1998 · 230 citations
BSM 7: RIE lag in high aspect ratio trench etching of silicon
Henri Jansen, M. de Boer, Remco J. Wiegerink et al. · Microelectronic Engineering · 1997 · 144 citations · Full text