H. A. C. Tilmans

LPCVD silicon-rich silicon nitride films for applications in micromechanics, studied with statistical experimental design*

H. A. C. Tilmans, C.C.G. Visser · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1996 · 172 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Creep as a reliability problem in MEMS

Robert Modliński, Ann Witvrouw, Petar Ratchev et al. · Microelectronics Reliability · 2004 · 47 citations

Engineering, Mechanical Engineering, Mechanical Behavior Of Materials +11

RF MEMS for ubiquitous wireless connectivity. Part II. Application

Héctor J. De Los Santos, Georg Fischer, H. A. C. Tilmans et al. · IEEE Microwave Magazine · 2004 · 43 citations

Engineering, Electrical Engineering, Systems Engineering +16

High-Q torsional mode Si triangular beam resonators encapsulated using SiGe thin film

Y. Naito, Philippe Hélin, Kazuo Nakamura et al. · 2010 · 22 citations

Engineering, Electrical Engineering, Materials Science +17

Above-IC generic poly-SiGe thin film wafer level packaging and MEM device technology: Application to accelerometers

Baicang Guo, Lianggong Wen, Philippe Hélin et al. · 2011 · 19 citations

Engineering, Materials Science, Microelectromechanical Systems +16