Selective bonding and encapsulation for wafer-level vacuum packaging of MEMS and related micro systems

Local laser bonding for low temperature budget

Ulrich Mescheder, M. Alavi, K. Hiltmann et al. · Sensors and Actuators A Physical · 2002 · 64 citations

Engineering, Materials Engineering, Materials Science +8

Hermetic wafer bonding based on rapid thermal processing

Mu Chiao, Liwei Lin · Sensors and Actuators A Physical · 2001 · 40 citations

Engineering, Materials Engineering, Materials Science +10

Low pressure and low temperature hermetic wafer bonding using microwave heating

N. Budraa, H. W. Jackson, M. Barmatz et al. · 1999 · 39 citations

Engineering, Electrical Engineering, Materials Science +14

Challenges in the Packaging of MEMS

WILLIAM D BROWN · University of North Texas Digital Library (University of North Texas) · 1999 · 26 citations · Full text

Engineering, Electrical Engineering, Mechanical Engineering +17

<title>Advances in silicon-to-glass bonding with laser</title>

Michael J. Wild, Arnold Gillner, Reinhart Poprawe · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2001 · 16 citations

Engineering, Materials Engineering, Materials Science +17