Concepedia
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Publications
4
Citations
292
H-Index
Active since
1999
Affiliations
Chinese University of Hong Kong(Current)
Microwave Bonding Instruments (United States)
N. Budraa is an author at Chinese University of Hong Kong specializing in microfabrication, engineering, and nanofluidics.
Top concepts
EngineeringMicrofabricationNanofluidicsMicrofluidicsApplied PhysicsPolymer ScienceMaterial ScienceElectronic PackagingPhysicsThin Films
Publications per year
1999–2004
Analysis of the low-temperature specific heat of multiwalled carbon nanotubes and carbon nanotube ropes
Ari Mizel, Lorin X. Benedict, Marvin L. Cohen et al. · Physical review. B, Condensed matter · 1999 · 149 citations
Microwave bonding of polymer-based substrates for potential encapsulated micro/nanofluidic device fabrication
Kin Fong Lei, Syed Muhammad Ahsan, N. Budraa et al. · Sensors and Actuators A Physical · 2004 · 88 citations
Engineering, Microwave Bonding, Microfabrication +9
Low pressure and low temperature hermetic wafer bonding using microwave heating
N. Budraa, H. W. Jackson, M. Barmatz et al. · 1999 · 39 citations
Materials Engineering, Materials Science, Wafer Scale Processing +15
Microwave bonding of polymer-based substrates for micro-nano fluidic applications
Kin Fong Lei, Wen J. Li, N. Budraa · 2004 · 16 citations
Materials Science, Engineering, Polymer Technology +13
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