Statistics
Publications
4
Citations
295
H-Index
4
Active since
1999
Affiliations
N. Budraa is an author at Chinese University of Hong Kong specializing in materials science, bonding, and materials engineering.
Publications per year
1999–2004
4
4
Low pressure and low temperature hermetic wafer bonding using microwave heating
N. Budraa, H. W. Jackson, M. Barmatz et al. · 1999 · 39 citations
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