Application of electroless Ni–Zn–P film for under-bump metallization on solder joint

Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology

Jihun Jang, P. G. Kim, K. N. Tu et al. · Journal of Applied Physics · 1999 · 283 citations

Natural Sciences, Materials Engineering, Materials Science +17

Crystallisation kinetics and phase transformation behaviour of electroless nickel–phosphorus deposits with high phosphorus content

K.G. Keong, Savko Malinov · Journal of Alloys and Compounds · 2002 · 230 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +13

Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging

Moon Gi Cho, Sung K. Kang, Da‐Yuan Shih et al. · Journal of Electronic Materials · 2007 · 138 citations

Natural Sciences, Materials Engineering, Materials Science +17

Electrolessly deposited diffusion barriers for microelectronics

E. J. O’Sullivan, A. G. Schrott, Milan Paunović et al. · IBM Journal of Research and Development · 1998 · 137 citations

Natural Sciences, Materials Engineering, Materials Science +17

A comparative study on the crystallization behavior of electroless NiP and NiCuP deposits

Huisheng Yu, Shou-Fu Luo, Yong-Rui Wang · Surface and Coatings Technology · 2001 · 115 citations

Natural Sciences, Materials Engineering, Materials Science +17