Concepedia

The effect of small additions of copper on the aging kinetics of the intermetallic layer and intermetallic particles of eutectic tin-silver solder joints

Jeff Sigelko, S. Choi, K. N. Subramanian, J. P. Lucas

Journal of Electronic Materials · 2000 · 28 citations · 8 references

DOI

Concepts

References

8

Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys

D. R. Frear, Paul T. Vianco · Metallurgical and Materials Transactions A · 1994 · 275 citations

, , +16

A viable tin-lead solder substitute: Sn-Ag-Cu

Chad M. Miller, Iver E. Anderson, Jack Smith · Journal of Electronic Materials · 1994 · 261 citations

, , +9

Phase Transformations in Metals and Alloys -2nd ed.-

David Porter, K. E. Easterling · 1992 · 245 citations

, , +14

Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging

S. Choi, Thomas R. Bieler, J. P. Lucas et al. · Journal of Electronic Materials · 1999 · 215 citations

, , +17

Activation energies of intermetallic growth of Sn-Ag eutectic solder on copper substrates

D. R. Flanders, Elizabeth G. Jacobs, Russell F. Pinizzotto · Journal of Electronic Materials · 1997 · 134 citations

, , +14