Wafer-level packaging of silicon to glass with a BCB intermediate layer using localised laser heating

Adhesive wafer bonding

Frank Niklaus, Göran Stemme, Jian‐Qiang Lu et al. · Journal of Applied Physics · 2006 · 463 citations

Engineering, Materials Engineering, Materials Science +17

MEMS post-packaging by localized heating and bonding

Liwei Lin · IEEE Transactions on Advanced Packaging · 2000 · 174 citations

Engineering, Materials Engineering, Materials Science +17

PMMA to SU-8 bonding for polymer based lab-on-a-chip systems with integrated optics

Brian Bilenberg, Tom Hamborg Nielsen, B. Clausen et al. · Journal of Micromechanics and Microengineering · 2004 · 162 citations

Natural Sciences, Materials Engineering, Materials Science +17

Wafer bonding using microwave heating of parylene intermediate layers

Hongseok Noh, Kyoung‐sik Moon, Andrew Cannon et al. · Journal of Micromechanics and Microengineering · 2004 · 152 citations

Engineering, Materials Engineering, Materials Science +17

Localized induction heating solder bonding for wafer level MEMS packaging

Hsueh-An Yang, Mingching Wu, Weileun Fang · Journal of Micromechanics and Microengineering · 2004 · 115 citations

Engineering, Electrical Engineering, Materials Science +17