Weileun Fang

Localized induction heating solder bonding for wafer level MEMS packaging

Hsueh-An Yang, Mingching Wu, Weileun Fang · Journal of Micromechanics and Microengineering · 2004 · 115 citations

Engineering, Electrical Engineering, Materials Science +17

Implementation of a Monolithic Single Proof-Mass Tri-Axis Accelerometer Using CMOS-MEMS Technique

Chih-Ming Sun, Ming‐Han Tsai, Yu‐Chia Liu et al. · IEEE Transactions on Electron Devices · 2010 · 87 citations

Engineering, Electrical Engineering, Mechanical Engineering +17

Micromachined rubber O-ring micro-fluidic couplers

Tze-Jung Yao, Sangwook Lee, Weileun Fang et al. · 2002 · 48 citations · Full text

Engineering, Materials Science, Mechanical Engineering +10

On the sensitivity improvement of CMOS capacitive accelerometer

Chih-Ming Sun, ChuanWei Wang, Weileun Fang · Sensors and Actuators A Physical · 2007 · 44 citations

Engineering, Electrical Engineering, Mechanical Engineering +14

Implementation of the CMOS MEMS Condenser Microphone with Corrugated Metal Diaphragm and Silicon Back-Plate

Chien‐Hsin Huang, Chien-Hsing Lee, Tsung-Min Hsieh et al. · Sensors · 2011 · 38 citations · Full text

Engineering, Physics, Acoustics +16