Hsueh-An Yang

Localized induction heating solder bonding for wafer level MEMS packaging

Hsueh-An Yang, Mingching Wu, Weileun Fang · Journal of Micromechanics and Microengineering · 2004 · 115 citations

Engineering, Electrical Engineering, Materials Science +17

Implementation of silicon-on-glass MEMS devices with embedded through-wafer silicon vias using the glass reflow process for wafer-level packaging and 3D chip integration

Chiung-Wen Lin, Chia-Pao Hsu, Hsueh-An Yang et al. · Journal of Micromechanics and Microengineering · 2008 · 57 citations

Engineering, Materials Engineering, Materials Science +17

Implementation of three-dimensional SOI-MEMS wafer-level packaging using through-wafer interconnections

Chiung-Wen Lin, Hsueh-An Yang, Wei Wang et al. · Journal of Micromechanics and Microengineering · 2007 · 47 citations

Engineering, Electrical Engineering, Microelectromechanical Systems +16

Hemispherical wineglass resonators fabricated from the microcrystalline diamond

Amir Heidari, Mei-Lin Chan, Hsueh-An Yang et al. · Journal of Micromechanics and Microengineering · 2013 · 46 citations

Engineering, Materials Engineering, Materials Science +16

A Novel Coilless Scanning Mirror Using Eddy Current Lorentz Force and Magnetostatic Force

Hsueh-An Yang, Tsung-Lin Tang, Sheng Ta Lee et al. · Journal of Microelectromechanical Systems · 2007 · 30 citations

Engineering, Electrical Engineering, Materials Science +17