Chiung-Wen Lin

Implementation of silicon-on-glass MEMS devices with embedded through-wafer silicon vias using the glass reflow process for wafer-level packaging and 3D chip integration

Chiung-Wen Lin, Chia-Pao Hsu, Hsueh-An Yang et al. · Journal of Micromechanics and Microengineering · 2008 · 56 citations

Mems Devices, Engineering, Device Integration +18

Implementation of three-dimensional SOI-MEMS wafer-level packaging using through-wafer interconnections

Chiung-Wen Lin, Hsueh-An Yang, Wei Wang et al. · Journal of Micromechanics and Microengineering · 2007 · 47 citations

Advanced Packaging, 3D Ic Architecture, Electrical Engineering +15

Novel glass microprobe arrays for neural recording

Chiung-Wen Lin, Yu‐Tao Lee, Chih-Wei Chang et al. · Biosensors and Bioelectronics · 2009 · 22 citations

Neurochip, Neural Interface, Neural Recording +1

On the selective magnetic induction heating of micron scale structures

Hsueh-An Yang, Chiung-Wen Lin, Chih-Yu Peng et al. · Journal of Micromechanics and Microengineering · 2006 · 19 citations

Engineering, Magnetism, Magnetic Induction Heating +19

A pseudo 3D glass microprobe array: glass microprobe with embedded silicon for alignment and electrical interconnection during assembly

Yu‐Tao Lee, Chiung-Wen Lin, Chia-Min Lin et al. · Journal of Micromechanics and Microengineering · 2009 · 18 citations

Engineering, Pseudo 3D, Glass Microprobe Array +17