Concepedia

Author

Chiung-Wen Lin

National Tsing Hua University

Also Known As

Chiung-Wen Lin

15

Publications

195

Citations

7

H-Index

26

Concepts

All Affiliations

National Tsing Hua UniversityAdvanced Semiconductor Engineering (Taiwan)
CL

About

Chiung-Wen Lin is an author at National Tsing Hua University specializing in engineering, microfabrication, and microelectronics.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

5

5

153

2

Applied Physics

2

2

32

3

Biomedical Engineering

2

2

40

4

Electrical Engineering

2

2

103

5

Materials Engineering

1

1

13

Chiung-Wen Lin

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6

Publications

175

Citations

6

H-Index

YearCitations

Implementation of silicon-on-glass MEMS devices with embedded through-wafer silicon vias using the glass reflow process for wafer-level packaging and 3D chip integration

Chiung-Wen Lin, Chia-Pao Hsu, Hsueh-An Yang,

Journal of Micromechanics and Microengineering

2008

56

Implementation of three-dimensional SOI-MEMS wafer-level packaging using through-wafer interconnections

Chiung-Wen Lin, Hsueh-An Yang, Wei Wang,

Journal of Micromechanics and Microengineering

2007

47

Novel glass microprobe arrays for neural recording

Chiung-Wen Lin, Yu‐Tao Lee, Chih-Wei Chang,

Biosensors and Bioelectronics

2009

22

On the selective magnetic induction heating of micron scale structures

Hsueh-An Yang, Chiung-Wen Lin, Chih-Yu Peng,

Journal of Micromechanics and Microengineering

2006

19

A pseudo 3D glass microprobe array: glass microprobe with embedded silicon for alignment and electrical interconnection during assembly

Yu‐Tao Lee, Chiung-Wen Lin, Chia-Min Lin,

Journal of Micromechanics and Microengineering

2009

18

Wafer level self-assembly of microstructures using global magnetic lifting and localized induction welding

Hsueh-An Yang, Chiung-Wen Lin, Weileun Fang

Journal of Micromechanics and Microengineering

2005

13

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