Chia-Pao Hsu

Implementation of silicon-on-glass MEMS devices with embedded through-wafer silicon vias using the glass reflow process for wafer-level packaging and 3D chip integration

Chiung-Wen Lin, Chia-Pao Hsu, Hsueh-An Yang et al. · Journal of Micromechanics and Microengineering · 2008 · 57 citations

Engineering, Materials Engineering, Materials Science +17

Implementation of a gap-closing differential capacitive sensing<i>Z</i>-axis accelerometer on an SOI wafer

Chia-Pao Hsu, Ming‐Chuen Yip, Weileun Fang · Journal of Micromechanics and Microengineering · 2009 · 38 citations

Engineering, Electrical Engineering, Materials Science +17

Design and implementation of a torque-enhancement 2-axis magnetostatic SOI optical scanner

Tsung-Lin Tang, Chia-Pao Hsu, Wen-Chien Chen et al. · Journal of Micromechanics and Microengineering · 2010 · 21 citations

Natural Sciences, Materials Engineering, Materials Science +10

Method for sensitivity improvement and optimal design of a piezoresistive pressure sensor

Hsieh-Shen Hsieh, Heng-Chung Chang, Chih-Fan Hu et al. · 2010 · 11 citations

Engineering, Manufacturing Engineering, Mechanical Engineering +17