2009 · 26 citations · 3 references
Natural SciencesMaterials EngineeringMaterials ScienceElectronic MaterialsMaterials CharacterizationSemiconductor DevicesRaman SpectroscopySemiconductor Device MaterialsSilicon MaterialsStress-strain BehaviorRaman Data AnalysisRaman Spectroscopy Strain AnalysisSiliconStress MeasurementThrough-silicon Via DesignThrough-silicon Via PackagingThrough-silicon Vias
In this paper, we will present Micro Raman stress data of Through Silicon Vias (TSV) with different shapes and sizes & spacing, and discuss design considerations.
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3D Integration Techniques Applied to SiGe Power Amplifiers
Ramana Malladi, Alvin Joseph, Peter Lindgren et al. · ECS Transactions · 2008 · 11 citations