Electroless processes for micro- and nanoelectronics

Full copper wiring in a sub-0.25 μm CMOS ULSI technology

D. Edelstein, J. Heidenreich, R. Goldblatt et al. · 2002 · 352 citations

Engineering, Computer Engineering, Electrical Engineering +17

Electroless copper deposition for ULSI

Yosi Shacham‐Diamand, Valery M. Dubin, M. Angyal · Thin Solid Films · 1995 · 224 citations · Full text

Natural Sciences, Electrical Engineering, Materials Science +17

Metallization: theory and practice for VLSI and ULSI

Choice Reviews Online · 1993 · 209 citations

Natural Sciences, Electrical Engineering, Materials Science +17

Barriers Against Copper Diffusion into Silicon and Drift Through Silicon Dioxide

Shi‐Qing Wang · MRS Bulletin · 1994 · 195 citations

Engineering, Materials Engineering, Materials Science +14

Comparison of the diffusion barrier properties of chemical-vapor-deposited TaN and sputtered TaN between Cu and Si

Mei‐Hui Tsai, Shuo Sun, C.E. Tsai et al. · Journal of Applied Physics · 1996 · 174 citations

Natural Sciences, Materials Engineering, Materials Science +17