Microstructure and Sn Crystal Orientation Evolution in Sn-3.5Ag Lead-Free Solders in High-Temperature Packaging Applications

The Changing Automotive Environment: High-Temperature Electronics

Wayne Johnson, John L. Evans, Peter Jacobsen et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2004 · 854 citations

Engineering, Automotive Engineering, Electrical Engineering +17

Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints

Thomas R. Bieler, Hairong Jiang, L.P. Lehman et al. · IEEE Transactions on Components and Packaging Technologies · 2008 · 260 citations

Engineering, Materials Engineering, Materials Science +17

Cyclic twin nucleation in tin-based solder alloys

L.P. Lehman, Yan Xing, Thomas R. Bieler et al. · Acta Materialia · 2010 · 212 citations

Natural Sciences, Materials Engineering, Materials Science +12

The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue

Donald W. Henderson, James J. Woods, Timothy Gosselin et al. · Journal of materials research/Pratt's guide to venture capital sources · 2004 · 198 citations

Natural Sciences, Materials Engineering, Materials Science +11

The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints

Thomas R. Bieler, Bite Zhou, Lauren Blair et al. · Journal of Electronic Materials · 2011 · 129 citations

Natural Sciences, Materials Engineering, Materials Science +17