Effect of low-frequency power on etching of SiCOH low-k films in CHF3 13.56MHz/2MHz dual-frequency capacitively coupled plasma

Low dielectric constant materials for microelectronics

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Developments of Plasma Etching Technology for Fabricating Semiconductor Devices

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Plasma enhanced chemical vapor deposited SiCOH dielectrics: from low-<i>k</i> to extreme low-<i>k</i> interconnect materials

A. Grill · Journal of Applied Physics · 2003 · 245 citations

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Diagnostics of nitrogen plasma by trace rare-gas–optical emission spectroscopy

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