2006 · 10 citations · 1 references
EngineeringComputer EngineeringElectrical EngineeringComputational ElectromagneticsMicroelectronicsPackaging DesignIntegral Equation FormulationsIntegral EquationsIntegrated Circuit DesignInterconnect DesignPackaging EngineeringVery-large-scale Integration LayoutAdvanced PackagingFrequency-domain Integral EquationsLow-frequency BreakdownNumerical Methods For Integral EquationsPackage InterconnectsPackage ModelingPackage ParasiticsRadio-frequency Packaging
Fast integral equation methods are now being applied to packaging and other such "low frequency" problems. This paper explores some of the issues surrounding such an application to real, product level packaging and interconnects type structures. Discussed are issues such as low frequency breakdown, mesh aspect ratios, and solver convergence. Finally, integral equation solver examples are presented using the IBM internally developed pre-corrected FFT (PFFT) solver labeled EMSurf
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