Cross-Sectional Tem Sample Preparation Method Using Fib Etching for Thin-Film Transistor

Effects of grain orientation on hillock formation and grain growth in aluminum films on silicon substrates

John E. Sanchez, Eduard Arzt · Scripta Metallurgica et Materialia · 1992 · 127 citations

Materials Science, Epitaxial Growth, Engineering +10

Recent Developments in the use of the Tripod Polisher for TEM Specimen Preparation

J. Benedict, Ron Anderson, Stanley J. Klepeis · MRS Proceedings · 1991 · 91 citations

Materials Science, Tem Specimen Preparation, Tripod Polisher +8

A transmission electron microscopy study of hillocks in thin aluminum films

Fredric Ericson, Nils Kristensen, Jan‐Åke Schweitz et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1991 · 81 citations

Materials Science, Aluminium Nitride, Surface Characterization +14

Transmission Electron Microscope Sample Preparation Using a Focused Ion Beam

T. Ishitani, Hideki Tsuboi, Toshie Yaguchi et al. · Journal of Electron Microscopy · 1994 · 57 citations

Materials Science, Electrical Engineering, Ion Implantation +13

The effect of grain orientation on the relaxation of thermomechanical stress and hillock growth in AI-1%Si conductor layers on silicon substrates

R. A. Schwarzer, D. Gerth · Journal of Electronic Materials · 1993 · 50 citations

Materials Engineering, Materials Science, Hillock Growth +14