Ron Anderson

SiGe-on-insulator prepared by wafer bonding and layer transfer for high-performance field-effect transistors

Lida Huang, J. O. Chu, D. Canaperi et al. · Applied Physics Letters · 2001 · 111 citations

Semiconductor Technology, Electrical Engineering, Wafer Scale Processing +15

Evidence for surface asperity mechanism of conductivity in oxide grown on polycrystalline silicon

Ron Anderson, D. R. Kerr · Journal of Applied Physics · 1977 · 103 citations

High Conductivity, Engineering, Silicon On Insulator +17

Recent Developments in the use of the Tripod Polisher for TEM Specimen Preparation

J. Benedict, Ron Anderson, Stanley J. Klepeis · MRS Proceedings · 1991 · 91 citations

Materials Science, Tem Specimen Preparation, Tripod Polisher +8

A Grinding/Polishing Tool for TEM Sample Preparation

Stanley J. Klepeis, J. Benedict, Ron Anderson · MRS Proceedings · 1987 · 72 citations

Materials Science, Engineering, Material Processing +7

Electron and hole mobility enhancement in strained SOI by wafer bonding

Lijuan Huang, J. O. Chu, S. Goma et al. · IEEE Transactions on Electron Devices · 2002 · 57 citations

Materials Science, Materials Engineering, Electrical Engineering +14