IEEE Transactions on Device and Materials Reliability · 2013 · 20 citations · 9 references
EngineeringElectrical EngineeringElectronic MaterialsMicroelectronicsSemiconductor DevicesDevice CharacterizationDevice ModelingDevice ReliabilityDevice SimulationMetal-oxide-semiconductor Field-effect TransistorsSemiconductor ReliabilityAvalanche BreakdownAvalanche Breakdown In Wide-bandgap DevicesBreakdown VoltageFailure MechanismsJunction BreakdownVoltage
The failure mechanisms for two kinds of the 750-V Superjunction VDMOS (SJ-VDMOS) devices with different charge imbalance conditions (Qp <; Qn and Qp > Qn) under unclamped inductive switching (UIS) condition are investigated in detail by experiments and 2-D devices simulations in this paper. For Qp <; Qn, only the channel current appears in the device during the UIS turn-off process, and the avalanche current appears after the device turns off. Finally, the parasitic transistor of the device is triggered when the drain voltage reaches the BV <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">OFF</sub> , so the device fails. Unlike Qp <; Qn, the SJ-VDMOS device fails before its drain voltage reaches the BV <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">OFF</sub> for the condition of Qp > Qn. Not only the channel current but also the avalanche current caused by ON-state breakdown appears during the UIS turn-off process until the gate voltage decreases below the threshold voltage in the SJ-VDMOS device. The avalanche current flows beneath the n+ region and leads to the activation of the parasitic transistor.
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Unclamped inductive switching dynamics in lateral and vertical power DMOSFETs
K. Chinnaswamy, P. Khandelwal, M. Trivedi et al. · 2003 · 25 citations